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BAP70AM,115

  •  BAP70AM,115
  • image of 射频二极管 BAP70AM,115
BAP70AM,115
RF Diodes
NXP USA Inc.
PIN - 2 Pair Se
-
6-TSSOP, SC-88, SOT-363
YES
TYPEDESCRIPTION
Factory Lead Time 13 Weeks
Package / Case 6-TSSOP, SC-88, SOT-363
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Terminal Finish Tin (Sn)
Additional Feature LOW DISTORTION
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP70A
Pin Count 6
JESD-30 Code R-PDSO-G6
Qualification Status Not Qualified
Number of Elements 4
Configuration 2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Power Dissipation-Max 300mW
Diode Type PIN - 2 Pair Series
Application ATTENUATOR
Current - Max 100mA
Capacitance @ Vr, F 0.25pF @ 20V 1MHz
Forward Voltage-Max 1.1V
Reverse Current-Max 0.1μA
Voltage - Peak Reverse (Max) 50V
Reverse Test Voltage 50V
Resistance @ If, F 1.9Ohm @ 100mA 100MHz
Diode Capacitance-Max 0.25pF
Minority Carrier Lifetime-Nom 1.25 µs
RoHS Status ROHS3 Compliant
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