+86 19924921798

BU7963GUW-E2

  •  BU7963GUW-E2
  • image of 接口IC BU7963GUW-E2
BU7963GUW-E2
Interface ICs
ROHM
Mobile Shrink D
-
63-VFBGA
YES
TYPEDESCRIPTION
Manufacturer Part Number:BU7963GUW-E2
Pbfree Code:Yes
Rohs Code:Yes
Part Life Cycle Code:Obsolete
Ihs Manufacturer:ROHM CO LTD
Part Package Code:BGA
Package Description:ROHS COMPLIANT, VBGA-63
Pin Count:63
Reach Compliance Code:compliant
HTS Code:8542.39.00.01
Manufacturer:ROHM Semiconductor
Risk Rank:8.03
Interface IC Type:INTERFACE CIRCUIT
JESD-30 Code:S-PBGA-B63
Length:5 mm
Number of Functions:1
Number of Terminals:63
Operating Temperature-Max:85 °C
Operating Temperature-Min:-30 °C
Package Body Material:PLASTIC/EPOXY
Package Code:VFBGA
Package Equivalence Code:BGA63,8X8,20
Package Shape:SQUARE
Package Style:GRID ARRAY
Peak Reflow Temperature (Cel):NOT SPECIFIED
Power Supplies:1.8 V
Qualification Status:Not Qualified
Seated Height-Max:0.9 mm
Subcategory:Line Driver or Receivers
Supply Current-Max:32.9 mA
Supply Voltage-Max:1.95 V
Supply Voltage-Min:1.65 V
Supply Voltage-Nom:1.8 V
Surface Mount:YES
Temperature Grade:OTHER
Terminal Form:BALL
Terminal Pitch:0.5 mm
Terminal Position:BOTTOM
[email protected] Reflow Temperature-Max (s):NOT SPECIFIED
Width:5 mm
PDF(1)
1.jpg
 Orignal genuine       Each chip comes from the original factory


2.jpg
       

 Main products       Only make original stock


3.jpg
        

 Spot inventory       Only make original stock

4.jpg       

Original stockBom DistributioAffordable Price

1

4.165

4.165

10

3.9608

39.608

100

3.7565

375.65

500

3.5423

1771.15

1000

3.338

3338

captcha

+86-755-82760106

ruizhengwei@gmail.com
0