 | |
| Orignal genuine | Each chip comes from the original factory |
| |
| Main products | Only make original stock |
| |
| Spot inventory | Only make original stock |
| |
| Original stock | Bom Distributio | Affordable Price |
| ： | BGSF110GN26E6327XTSA1 |
|---|---|
| ： | RF Integrated Circuits |
| ： | Infineon |
| ： | -port isolation |
| ： | - |
| ： | PG-TSNP-26-2 |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | BGSF110GN26E6327XTSA1 |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | INFINEON TECHNOLOGIES AG |
| Package Description: | TSNP-26 |
| Reach Compliance Code: | compliant |
| Factory Lead Time: | 12 Weeks |
| Manufacturer: | Infineon Technologies AG |
| Risk Rank: | 1.68 |
| JESD-30 Code: | R-PQCC-N26 |
| JESD-609 Code: | e4 |
| Length: | 3.4 mm |
| Moisture Sensitivity Level: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 26 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -30 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | HQCCN |
| Package Shape: | RECTANGULAR |
| Package Style: | CHIP CARRIER, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Seated Height-Max: | 0.77 mm |
| Supply Voltage-Nom: | 3 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Telecom IC Type: | TELECOM CIRCUIT |
| Temperature Grade: | OTHER |
| Terminal Finish: | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| Terminal Form: | NO LEAD |
| Terminal Position: | QUAD |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 2.6 mm |
| |
| Orignal genuine | Each chip comes from the original factory |
| |
| Main products | Only make original stock |
| |
| Spot inventory | Only make original stock |
| |
| Original stock | Bom Distributio | Affordable Price |
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