XCVC1502-2LSENSVG1369 System On Chip (SoC)_Motor driven IC_ Logic general IC_ Power IC_ Single chip microcomputer_ Optocoupler_ Sensor_ Diode triode

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TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	1369-BFBGA, FCBGA
Speed	450MHz, 1.08GHz
Number of I/O	500
Operating Temperature	0°C ~ 100°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Core FPGA, 800k Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1369-FCBGA (35x35)
Architecture	MPU, FPGA

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