XCVE1752-2MSEVSVA2197 System On Chip (SoC)_Motor driven IC_ Logic general IC_ Power IC_ Single chip microcomputer_ Optocoupler_ Sensor_ Diode triode

$21,405.0000

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TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	2197-BFBGA, FCBGA
Speed	600MHz, 1.4GHz
RAM Size	256KB
Number of I/O	608
Operating Temperature	0°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	2197-FCBGA (45x45)
Architecture	MPU, FPGA

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